摘要
Thispaperpresentstwoapproachestoperformtheelectronicdeviceheatingduringradiationhardnessassurancetests.Commonlyusedconductiveheatingapproachiscomparedwithcontactlesslaser-basedapproach,characteristicsandlimitationsofthesemethodsaredescribed.Experimentalresultsfortemperaturedependenceofsingle-eventlatchup(SEL)cross-sectionduringheavyionirradiationalongwithsomeaspectsofphysics-basednumericalsimulationofheattransferprocessesarepresented.
出版日期
2018年02月12日(中国期刊网平台首次上网日期,不代表论文的发表时间)