Development of Contactless Method of the DUT Heating during Single-Event Effect Tests

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摘要 Thispaperpresentstwoapproachestoperformtheelectronicdeviceheatingduringradiationhardnessassurancetests.Commonlyusedconductiveheatingapproachiscomparedwithcontactlesslaser-basedapproach,characteristicsandlimitationsofthesemethodsaredescribed.Experimentalresultsfortemperaturedependenceofsingle-eventlatchup(SEL)cross-sectionduringheavyionirradiationalongwithsomeaspectsofphysics-basednumericalsimulationofheattransferprocessesarepresented.
机构地区 不详
出版日期 2018年02月12日(中国期刊网平台首次上网日期,不代表论文的发表时间)
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